PCB Design for Embedded Systems
EMB 235 introduces students to the essential concepts and tools used in designing Printed Circuit Boards (PCBs) for embedded systems. Students will learn how to translate electronic schematics into manufacturable PCB layouts, considering component placement, routing constraints, signal integrity, power distribution, and thermal management. The course emphasizes industry best practices, common design standards, and the use of professional PCB design software. Through a combination of lectures, hands-on lab exercises, and design projects, students will gain practical experience in creating robust and reliable PCBs. Topics include selecting appropriate components, generating accurate Gerber files, understanding fabrication processes, and preparing for assembly. By the end of this course, students will be equipped to design single-layer and multi-layer PCBs suitable for a variety of embedded system applications.
Prerequisites
Course outline
Lectures, virtual labs, and graded assignments — completed in your browser.
Syllabus
### EMB 235: PCB Design for Embedded Systems **Course Outcomes:** Upon successful completion of this course, students will be able to: 1. Explain fundamental PCB design principles, including component selection, schematic capture, and layout considerations. 2. Utilize PCB design software to create professional schematics and multi-layer board layouts. 3. Apply best practices for signal integrity, power distribution, and electromagnetic compatibility (EMC) in PCB design. 4. Generate manufacturing files (Gerbers, drill files, BOM) and understand the PCB fabrication and assembly processes. 5. Debug and troubleshoot basic PCB design issues and prepare designs for production. **Weekly Topic List:** * **Week 1:** Introduction to PCB Design & Embedded Systems Context; Design Workflow Overview * **Week 2:** Schematic Capture Fundamentals; Component Libraries & Footprints * **Week 3:** Basic Circuit Layout: Single-Layer Boards & Component Placement * **Week 4:** Routing Techniques: Traces, Vias, and Ground Planes * **Week 5:** Multi-Layer PCB Design; Power and Ground Plane Strategies * **Week 6:** Signal Integrity (SI) and Electromagnetic Compatibility (EMC) Basics * **Week 7:** Power Delivery Networks (PDN) and Thermal Management * **Week 8:** Comprehensive Midterm Review * **Week 9:** Design Rule Checking (DRC) and Layout Verification * **Week 10:** Generating Manufacturing Files (Gerber, Drill, BOM) * **Week 11:** PCB Fabrication Processes and Materials * **Week 12:** PCB Assembly Techniques (SMT, Through-Hole) and Testing * **Week 13:** Design for Manufacturing (DFM) and Design for Assembly (DFA) * **Week 14:** Final Review **Grading Policy:** * Knowledge Checks: 15% * Assignments/Labs: 30% * Quizzes: 25% * Final Exam: 30% **Required Materials:** * **Textbook:** Online resources and selected readings provided by instructor. * **Software:** Altium Designer (student license), KiCad (open-source alternative). * **Hardware:** N/A (software-based design course).