Thin Film Deposition and Etch Engineering

Students will explore various physical and chemical vapor deposition techniques, including sputtering, evaporation, CVD, and ALD. The course also covers plasma etching, reactive ion etching, and wet etching processes, focusing on their mechanisms, equipment, and materials. Emphasis is placed on understanding process control, characterization methods, and their impact on device performance and yield in a production environment. Practical applications and real-world challenges in semiconductor manufacturing are integrated throughout the curriculum.

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01Introduction to Thin Films in Semiconductor Manufacturinglecture

02Vacuum Technology and Plasma Fundamentals for Thin Film Processinglecture

03Physical Vapor Deposition (PVD): Sputtering Principles and Equipmentlecture

04PVD: Evaporation Techniques and Industrial Applicationslecture

05Chemical Vapor Deposition (CVD): Basics and Low-Pressure CVD (LPCVD)lecture

06Plasma Enhanced Chemical Vapor Deposition (PECVD) and High-Density Plasma CVD (HDPCVD)lecture

07Atomic Layer Deposition (ALD): Principles, Precursors, and Applicationslecture

08Mid-Term Examination and Review of Deposition Technologieslecture

09Etch Fundamentals: Selectivity, Anisotropy, and Profile Controllecture

10Wet Etching: Chemistries, Mechanisms, and Process Challengeslecture

11Plasma Etching: Inductively Coupled Plasma (ICP) and Reactive Ion Etching (RIE)lecture

12Deep Reactive Ion Etching (DRIE) and Advanced Etch Applicationslecture

13Thin Film Characterization Techniques and Quality Controllecture

14Integration of Deposition and Etch Processes in Semiconductor Device Fabricationlecture

Syllabus

Each week features online lectures, assigned readings, and hands-on virtual lab simulations or problem sets to reinforce concepts. Students are expected to actively participate in online discussions and complete regular quizzes. There will be mid-term and final examinations assessing theoretical understanding and practical application skills. Late submissions will incur penalties, and academic integrity is strictly enforced according to institute policy. Expect to dedicate 10-12 hours per week to course material, assignments, and study. Collaboration on non-graded activities is encouraged; however, all graded work must be individual.