Atomic Layer Processing

Students will delve into the fundamental science behind atomic layer deposition (ALD) and atomic layer etching (ALE), exploring their unique advantages for precise thin film growth and removal. The curriculum covers various ALD/ALE precursors, reaction mechanisms, process optimization strategies, and equipment considerations essential for advanced device fabrication. Emphasis is placed on understanding how these atomic-scale techniques enable the creation of next-generation semiconductor devices with ultra-thin films and high aspect ratio structures. The course will also examine the integration challenges and potential solutions for implementing ALP in high-volume manufacturing.

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01Introduction to Atomic Layer Processing: Concepts and Importancelecture

02Fundamentals of Atomic Layer Deposition (ALD): Principles and Growth Mechanismslecture

03ALD Precursors: Chemistry, Selection, and Delivery Systemslecture

04Reaction Kinetics and Thermodynamics in ALDlecture

05ALD Reactor Design and Process Controllecture

06Characterization Techniques for ALD Filmslecture

07Advanced ALD Applications in Semiconductor Devices (e.g., High-k Dielectrics, Metal Gates)lecture

08Atomic Layer Etching (ALE): Principles and Mechanismslecture

09Plasma-Enhanced ALE and Thermal ALE Processeslecture

10Precursor and Plasma Chemistry for ALElecture

11Characterization Techniques for ALE Surfaceslecture

12Integration Challenges and Solutions for ALD/ALE in Manufacturinglecture

13Emerging Trends and Future Directions in Atomic Layer Processinglecture

14Final Project Presentations and Course Reviewlecture

Syllabus

This online course is structured into 14 weekly modules, each combining lectures, readings, video demonstrations, and interactive problem sets. Weekly assignments will include quizzes, simulation exercises, and critical analysis of research papers to reinforce theoretical concepts and practical applications. A significant portion of the grade will be based on a final project involving process design or a comprehensive literature review on a specific ALP application. Active participation in online discussions and adherence to academic integrity policies are expected throughout the semester. Late submissions will incur penalties, and all work must demonstrate original thought and proper citation. Students are encouraged to engage with peers and the instructor regularly to foster a collaborative learning environment.