Semiconductor Materials and Wafer Fabrication Overview
Students will explore the physical and chemical characteristics of key semiconductor materials like silicon and germanium, understanding how these properties enable electronic device functionality. The course covers the entire wafer fabrication process flow, from crystal growth and ingot slicing to polishing, cleaning, and basic epitaxy, emphasizing the critical role of each step in producing high-quality semiconductor substrates. Upon completion, students will be able to identify major fabrication techniques, explain their purpose, and recognize the impact of material characteristics on wafer quality and device performance, preparing them for more specialized semiconductor manufacturing topics.
Prerequisites
Course outline
Lectures, virtual labs, and graded assignments — completed in your browser.
Syllabus
Week 1: Introduction to Semiconductor Materials and Industry Week 2: Basic Atomic Structure and Crystalline Properties Week 3: Silicon Crystal Growth: Czochralski and Float Zone Methods Week 4: Ingot Preparation: Shaping, Grinding, and Slicing Week 5: Wafer Processing: Lapping, Etching, and Polishing Week 6: Wafer Cleaning Technologies and Techniques Week 7: Epitaxial Growth: CVD and MBE Overview Week 8: Doping and Junction Formation Fundamentals Week 9: Wafer Characterization: Electrical Properties Week 10: Wafer Characterization: Physical and Structural Properties Week 11: Introduction to Photolithography Basics Week 12: Thin Film Deposition Techniques Overview Week 13: Etching Processes for Pattern Transfer Week 14: Overview of Wafer Fabrication Process Integration