Semiconductor Manufacturing Processes I: Deposition
Students in this course gain a comprehensive understanding of various thin-film deposition methods essential for semiconductor manufacturing. They will explore the physics and chemistry behind techniques such as physical vapor deposition (PVD), chemical vapor deposition (CVD), and atomic layer deposition (ALD), including their process parameters, equipment, and material properties. Practical knowledge of film characterization and quality control, along with safety protocols relevant to deposition processes, is emphasized. Upon completion, students will be able to identify appropriate deposition techniques for specific device layers, troubleshoot common process issues, and contribute effectively to semiconductor cleanroom operations.
Prerequisites
Course outline
Lectures, virtual labs, and graded assignments — completed in your browser.
Syllabus
Week 1: Introduction to Thin Films and Deposition Processes Week 2: Vacuum Technology for Deposition Week 3: Physical Vapor Deposition (PVD) Overview Week 4: Evaporation Techniques Week 5: Sputtering Fundamentals and Systems Week 6: Chemical Vapor Deposition (CVD) Principles Week 7: Atmospheric Pressure CVD and Low Pressure CVD Week 8: Plasma-Enhanced CVD (PECVD) and High-Density Plasma CVD (HDPCVD) Week 9: Epitaxial Growth Techniques Week 10: Atomic Layer Deposition (ALD) Week 11: Spin Coating and Solution-Based Deposition Week 12: Film Characterization Techniques Week 13: Deposition Process Control and Troubleshooting Week 14: Safety and Environmental Considerations in Deposition