Etch Processes

Students will explore the fundamental principles, methodologies, and applications of wet and dry etch processes central to semiconductor device fabrication. This course delves into plasma physics, chemical reactions, and equipment used to selectively remove material layers, ensuring high-fidelity pattern transfer. Upon completion, students will be able to analyze etch characteristics, troubleshoot common process issues, and contribute to process optimization in various semiconductor manufacturing environments, understanding the impact of etch on device performance and yield.

Prerequisites

SET 201

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01Etching's Role in Semiconductor Manufacturinglecture

02Etch Fundamentals: Anisotropy and Selectivitylecture

03Basic Wet Etch Techniques and Materialslecture

04Controlling Etch Rates in Chemical Solutionslecture

05Wet Etch Quality and Yield Considerationslecture

06Plasma Etching: The Dry Revolutionlecture

07Understanding Plasma Sources and Parameterslecture

08Developing Anisotropic Etch Profiles with RIElecture

09Precise Trench and Via Formationlecture

10Optimizing High-Density Plasma Processeslecture

11Inside the Etch Reactor: Components and Functionlecture

12Measuring Etch Uniformity and Critical Dimensionslecture

13Solving Common Etch-Related Issueslecture

14Emerging Etch Technologies for Advanced Deviceslecture

Syllabus

Week 1: Introduction to Etch Processes in Semiconductor Manufacturing
Week 2: Fundamentals of Wet Etching
Week 3: Wet Etch Chemistries and Selectivity
Week 4: Etch Rate and Uniformity in Wet Processes
Week 5: Safety and Environmental Considerations in Wet Etching
Week 6: Introduction to Dry Etching and Plasma Generation
Week 7: Plasma Etch Mechanisms: Physical and Chemical
Week 8: Plasma Etch Equipment and Reactor Types
Week 9: Etch Selectivity, Anisotropy, and Profile Control in Dry Etching
Week 10: Endpoint Detection Techniques
Week 11: Etch Process Characterization and Metrology
Week 12: Advanced Etch Challenges: High Aspect Ratio and Damage Control
Week 13: Etch Defectivity and Yield Enhancement
Week 14: Future Trends in Etch Technology