Diffusion, Ion Implantation, and Thermal Processing

Students will gain an in-depth understanding of the principles and practical applications of dopant introduction and thermal treatments in semiconductor device fabrication. The course covers the physics of diffusion and ion implantation, their effects on material properties, and the equipment used in these processes. Students will learn to analyze process parameters, interpret characterization results, and identify common defects related to these critical manufacturing steps, preparing them for roles in process development, manufacturing, and quality control within the semiconductor industry.

Prerequisites

SET 201

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01Semiconductor Fabrication Overviewlecture

02Principles of Dopant Movementlecture

03Modeling Dopant Distributionlecture

04Controlling Diffusion Processeslecture

05Introduction to Particle Dopinglecture

06Ion Beam Generation and Controllecture

07Adjusting Implantation Parameterslecture

08Repairing Lattice Damagelecture

09Fundamentals of Heat Treatmentslecture

10Growing Thin Insulating Layerslecture

11Fast Thermal Cycle Applicationslecture

12Forming Metal-Semiconductor Contactslecture

13Combining Doping and Annealinglecture

14Measuring Doping Profiles and Film Thicknesslecture

Syllabus

Week 1: Introduction to Semiconductor Processing and Doping
Week 2: Fundamentals of Diffusion in Semiconductors
Week 3: Diffusion Mechanisms and Dopant Profiles
Week 4: Diffusion Furnaces and Process Control
Week 5: Ion Implantation Principles and Equipment
Week 6: Ion Implantation Doping Profiles and Damage
Week 7: Annealing and Activation of Implants
Week 8: Rapid Thermal Processing (RTP) Techniques
Week 9: Oxidation Growth Mechanisms and Kinetics
Week 10: Thermal Oxidation Processes and Applications
Week 11: Chemical Vapor Deposition (CVD) Basics for Thermal Films
Week 12: Advanced Thermal Processing Technologies
Week 13: Characterization Techniques for Doped and Thermally Treated Layers
Week 14: Process Integration Challenges and Yield in Doping and Thermal Steps