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SET 235
Term 5
3 credits
Metrology and Inspection for Manufacturing
Students will explore the fundamental principles, instrumentation, and applications of various metrology and inspection methods used throughout the semiconductor fabrication process. Topics include optical, electrical, and physical measurement techniques, along with an emphasis on data analysis and statistical process control for defect detection and yield improvement. Upon completion, students will be able to select appropriate metrology tools, interpret measurement data, and contribute to maintaining stringent quality standards in a semiconductor production environment.
Prerequisites
Course outline
Lectures, virtual labs, and graded assignments — completed in your browser.
01Introduction to Measurement Science in Semiconductorslecture
02Optical Principles for Wafer Inspectionlecture
03Measuring Linewidths and Gaps with Precisionlecture
04Characterizing Dielectric and Conductive Layerslecture
05Probing Electrical Properties of Deviceslecture
06Assessing Surface Uniformity and Texturelecture
07Identifying and Classifying Wafer Defectslecture
08Monitoring Airborne and Surface Particulateslecture
09Electron Beam Imaging for Material Analysislecture
10Compositional and Structural Analysis via X-rayslecture
11Nanoscale Surface Imaging with AFMlecture
12Metrology Challenges for Advanced Device Architectureslecture
13Applying Statistics to Process Control and Qualitylecture
14Interpreting Metrology Data for Production Optimizationlecture
Syllabus
Week 1: Introduction to Semiconductor Metrology and Inspection Week 2: Fundamental Principles of Measurement and Error Analysis Week 3: Optical Metrology Techniques: Overview and Applications Week 4: Critical Dimension (CD) Metrology: CD-SEM and CD-AFM Week 5: Thin Film Metrology: Ellipsometry and Reflectometry Week 6: Surface Topography and Roughness Metrology: AFM and Stylus Profilometry Week 7: Defect Inspection Techniques: Brightfield, Darkfield, and E-Beam Inspection Week 8: Particle Contamination Monitoring and Control Week 9: Electrical Test and Parametric Metrology Week 10: Overlay Metrology and Alignment Control Week 11: Stress and Strain Measurement in Semiconductor Devices Week 12: Advanced Metrology: X-ray Techniques and Acoustic Microscopy Week 13: Statistical Process Control (SPC) and Data Analysis for Metrology Week 14: Automated Metrology Systems and Future Trends in Inspection