IC Packaging and Assembly

This course delves into the essential principles and practices of integrated circuit (IC) packaging and assembly, building upon foundational knowledge from SET 225. Students will gain a comprehensive understanding of various package types, materials science considerations, and the intricate processes involved in transforming a bare die into a robust, protected, and interconnected component. Topics include wafer dicing, die attach, wire bonding, flip-chip, and advanced packaging solutions. Upon completion, students will be able to analyze packaging requirements, evaluate assembly methods, and troubleshoot common packaging-related issues, preparing them for roles in semiconductor manufacturing, quality assurance, and R&D.

Prerequisites

SET 225

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01The Role of Packaging in Semiconductor Manufacturinglecture

02Fundamentals of Package Design and Performancelecture

03Choosing Substrates: Materials and Processeslecture

04Attaching the Die: Adhesives and Eutectic Bondslecture

05Precision Wire Bonding: Methods and Challengeslecture

06Flip-Chip Interconnects: Design and Implementationlecture

07Protecting the Die: Encapsulation and Moldinglecture

08From Lead Frames to BGAs: Evolution of Packageslecture

09Wafer-Scale Integration: Principles and Applicationslecture

10Stacking Up: Introduction to 3D IC Packaginglecture

11Keeping Cool: Thermal Considerations in Packaginglecture

12Ensuring Signal Integrity in High-Speed Packageslecture

13When Packages Fail: Reliability Testing and Analysislecture

14The Road Ahead: Innovations in Packaging Technologylecture

Syllabus

Week 1: Introduction to IC Packaging and its Importance
Week 2: Fundamental Package Functions and Types
Week 3: Packaging Materials Science: Substrates and Encapsulants
Week 4: Wafer Dicing and Die Preparation Techniques
Week 5: Die Attach Processes and Adhesives
Week 6: Wire Bonding Principles and Methods
Week 7: Flip-Chip Technology and Bumping Processes
Week 8: Advanced Interconnect Technologies
Week 9: Package Sealing and Encapsulation Methods
Week 10: Thermal Management in IC Packages
Week 11: Electrical Performance and Signal Integrity
Week 12: Reliability Testing and Failure Analysis in Packaging
Week 13: Advanced Packaging Architectures and Future Trends
Week 14: Quality Control, Manufacturing Yield, and Course Review