Manufacturing Processes II: CMP and Metallization

Students will gain comprehensive knowledge of critical wafer manufacturing steps including Chemical Mechanical Planarization (CMP) and various metallization processes. The course covers the principles, equipment, and practical applications of these techniques, emphasizing their role in achieving desired device characteristics and yield. Through detailed study, learners will understand the challenges and solutions associated with creating intricate interconnects and planar surfaces on silicon wafers. Graduates will be prepared to analyze and optimize CMP and metallization processes, contributing to advanced semiconductor manufacturing operations and quality control.

Prerequisites

SET 205 SET 210

Course outline

Lectures, virtual labs, and graded assignments — completed in your browser.

01Overview of Advanced Fabrication Technologieslecture

02CMP: Mechanisms, Tools, and Materialslecture

03Slurry Formulations and Their Role in Planarizationlecture

04CMP Equipment: Operation and Controllecture

05Detecting and Mitigating CMP-Related Defectslecture

06Foundations of Metallic Film Depositionlecture

07PVD Techniques: Sputtering and Evaporationlecture

08PVD System Components and Process Optimizationlecture

09Metal CVD: Precursors and Reaction Chemistrylecture

10ALD for Conformal Metal and Barrier Layerslecture

11Copper Electroplating for Dual Damascenelecture

12Gate and Contact Metallization Strategieslecture

13Advanced Interconnect Architecture and Materialslecture

14Yield and Reliability in Backend-of-Line Processinglecture

Syllabus

Week 1: Introduction to Advanced Front-End-of-Line (FEOL) and Back-End-of-Line (BEOL) Processes
Week 2: Fundamentals of Chemical Mechanical Planarization (CMP)
Week 3: CMP Slurries, Pads, and Equipment Configurations
Week 4: CMP Process Control and Monitoring Techniques
Week 5: CMP Defects, Troubleshooting, and Yield Impact
Week 6: Post-CMP Cleaning and Surface Preparation
Week 7: Introduction to Thin Film Deposition for Metallization
Week 8: Physical Vapor Deposition (PVD) Techniques
Week 9: Chemical Vapor Deposition (CVD) of Metals
Week 10: Atomic Layer Deposition (ALD) for Metallization
Week 11: Electroplating and Electroless Plating for Interconnects
Week 12: Metallization Reliability and Failure Mechanisms
Week 13: Advanced Interconnect Materials and Architectures
Week 14: Integration Challenges and Future Trends in CMP and Metallization