M.S. Degree
Semiconductor Engineering
A 30-credit master of science for engineers who already hold a bachelor's in semiconductor, electronics, or a related engineering field. Four terms of 500-level coursework cover advanced semiconductor physics, advanced lithography and EUV systems, atomic layer processing, process modeling and simulation, yield science and failure analysis, advanced packaging and heterogeneous integration, fab automation and machine learning, reliability physics, manufacturing management, and a graduate capstone research project.
Outcomes
What you will be able to do
- 01Analyze advanced device structures and transport physics
- 02Evaluate EUV and atomic-scale patterning process windows
- 03Build and validate process and yield models from fab data
- 04Apply reliability physics to qualify devices and packages
- 05Plan, execute, and defend a graduate research project
Careers
Where graduates work
- Senior process engineer
- Device engineer
- Yield science engineer
- Advanced packaging engineer
- Reliability engineer
Curriculum
Term 1
Advanced Semiconductor Physics
Explore advanced principles of semiconductor physics, device operation, and emerging materials for modern electronic and optoelectronic technologies.
Advanced Lithography and EUV Systems
Advanced Lithography and EUV Systems covers fundamental and cutting-edge lithography principles, processes, and equipment essential for semiconductor manufacturing.
Atomic Layer Processing
This course provides a comprehensive understanding of Atomic Layer Processing (ALP) principles, applications, and characterization techniques for advanced semiconductor manufacturing.
Term 2
Advanced Process Modeling and Simulation
This course covers advanced principles and applications of process modeling and simulation in semiconductor manufacturing, focusing on modern computational techniques.
Yield Science and Failure Analysis
SEG 520 covers fundamental principles of semiconductor yield enhancement and advanced failure analysis techniques, crucial for improving product reliability and manufacturing efficiency.
Term 3
Advanced Packaging and Heterogeneous Integration
SEG 525 explores advanced semiconductor packaging techniques and the principles of heterogeneous integration for high-performance and miniaturized electronic systems.
Fab Automation, Data and Machine Learning
This course explores semiconductor fabrication automation, data management, and machine learning applications to optimize manufacturing processes and yield.
Reliability Physics
SEG 535 explores semiconductor device reliability mechanisms, failure analysis techniques, and lifetime prediction models crucial for advanced semiconductor engineering.
Term 4
Semiconductor Manufacturing Management
This course provides a comprehensive overview of semiconductor manufacturing operations, supply chain, and management strategies for engineers and technical managers.
Graduate Capstone Research Project
This course guides students through independent research culminating in a significant project demonstrating advanced semiconductor engineering technology knowledge and skills.
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